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X-Ray Scattering Investigations Of Metallic Thin Films, Andrew Warren
X-Ray Scattering Investigations Of Metallic Thin Films, Andrew Warren
Electronic Theses and Dissertations
Nanometric thin films are used widely throughout various industries and for various applications. Metallic thin films, specifically, are relied upon extensively in the microelectronics industry, among others. For example, alloy thin films are being investigated for CMOS applications, tungsten films find uses as contacts and diffusion barriers, and copper is used often as interconnect material. Appropriate metrology methods must therefore be used to characterize the physical properties of these films. Xray scattering experiments are well suited for the investigation of nano-scaled systems, and are the focus of this doctoral dissertation. Emphasis is placed on (1) phase identification of polycrystalline thin …
Optimization Of Process Parameters For Faster Deposition Of Cuin1-Xgaxs2 And Cuin1-Xgaxse2-Ysy Thin Film Solar Cells, Ashwani Kaul
Optimization Of Process Parameters For Faster Deposition Of Cuin1-Xgaxs2 And Cuin1-Xgaxse2-Ysy Thin Film Solar Cells, Ashwani Kaul
Electronic Theses and Dissertations
Thin film solar cells have the potential to be an important contributor to the world energy demand in the 21st century. Among all the thin film technologies, CuInGaSe2 (CIGS) thin film solar cells have achieved the highest efficiency. However, the high price of photovoltaic (PV) modules has been a major factor impeding their growth for terrestrial applications. Reduction in cost of PV modules can be realized by several ways including choosing scalable processes amenable to large area deposition, reduction in the materials consumption of active layers, and attaining faster deposition rates suitable for in-line processing. Selenization-sulfurization of sputtered metallic Cu-In-Ga …
Classical Size Effect In Copper Thin Films: Impact Of Surface And Grain Boundary Scattering On Resistivity, Tik Sun
Electronic Theses and Dissertations
Surface and grain boundary electron scattering contribute significantly to resistivity as the dimensions of polycrystalline metallic conductors are reduced to, and below, the electron mean free path. A quantitative measurement of the relative contributions of surface and grain boundary scattering to resistivity is very challenging, requiring not only the preparation of suitably small conductors having independent variation of the two relevant length scales, namely, the sample critical dimension and the grain size, but also independent experimental quantification of these two length scales. In most work to date the sample grain size has been either assumed equal to conductor dimension or …