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Interface Reaction Induced Stress Development In An Aluminum Thin Film Copper Bulk Plate Diffusion Couple, Michael Codie Mishler

Material Science and Engineering Theses

This thesis investigates the mechanism of the interface reaction induced intermetallic phase formation (IMC) and its impact on the interface reliability in Al-Cu diffusion couple pairing. This study is motivated by the accelerated failure experiments in lead frame to integrated circuit (IC) package wire-bonds using copper (Cu) wire and aluminum (Al) bond-pad that have shown failure most often occurs at the interface of the intermetallic compound (IMC) γ2-phase (Cu9Al4). In order for simulative investigation, we created a diffusion couple consisting of Cu bulk plate coated pure Al thin films with thickness of ~2µm. This configuration is adapted to resemble the …

Initiated Chemical Vapor Deposition (Icvd) Polymer Thin Films : Structure-Property Effects On Thermal Degradation And Adhesion, Vijay Jain Bharamaiah Jeevendrakumar

Legacy Theses & Dissertations (2009 - 2024)

Opportunities and challenges for chemical vapor deposition (CVD) of polymer thin films stems from their applications in electronics, sensors, and adhesives with demands for control over film composition, conformity and stability. Initiated chemical vapor deposition (iCVD) is a subset of the CVD technique that conjoins bulk free-radical polymerization chemistry with gas-phase processing. The novelty of iCVD technique stems from the use of an initiator that can be activated at low energies (150 – 300 °C) to react with surface adsorbed monomer to form a polymer film. This reduces risk for potential unwarranted side-reactions.

Synthesis, Structure, Properties And Applications Of Nanoporous Silicon And Palladium, Xu Jiang

Theses and Dissertations--Chemical and Materials Engineering

Nanoporous (np) materials with pore size below 100 nano-meters exist naturally in biological and mineral structures, and synthetic np materials have been used industrially for centuries. Np materials have attracted significant research interest in recent decades, as the development of new characterization techniques and nanotechnology allow the observation and design of np materials at a new level. This study focuses on two np materials: nanoporous silicon (np-Si) and nanoporous palladium (np-Pd).

Silicon (Si), because of its high capacity to store lithium (Li), is increasingly becoming an attractive candidate as anode material for Li ion batteries (LIB). One significant problem with …

The Impact Of Seed Layer Structure On The Recrystallization Of Ecd Cu And Its Alloys, Brendan B. O'Brien

Legacy Theses & Dissertations (2009 - 2024)

Despite the significant improvements originally offered by the use of Cu over Al as the interconnect material for semiconductor devices, the continued down-scaling of interconnects has presented significant challenges for semiconductor engineers. As the metal line widths shrink, both the conductivity and reliability of lines decrease due to a stubbornly fine-grained microstructure in narrow lines.