Open Access. Powered by Scholars. Published by Universities.®
Articles 1 - 2 of 2
Full-Text Articles in Entire DC Network
Resonant Spectra Of Metal Nanotoroids Of Various Sizes, Huong Quynh Tran
Resonant Spectra Of Metal Nanotoroids Of Various Sizes, Huong Quynh Tran
Electrical Engineering Undergraduate Honors Theses
Nowadays, the manipulation of light by using metallic nanostructures has wide applications in photonics, optoelectronics and energy conversion. Along with other universities all over the world, the University of Arkansas is researching on nano-antennas’ design, fabrication and applications. Current research in Dr. El-Shenawee’s Terahertz Imaging and Spectroscopy Computational Electromagnetics Group, has computationally investigated the behaviors of plasmonic nanostructures by using the commercial finite element electromagnetic solver Ansys® HFSS. This work reproduced the previous work of spectral absorption enhancement of infinite and finite arrays of silver and gold nanotoroids with sizes of the inner radii: 13nm – 21nm, while outer radius …
Comparison Of Low-Temperature Co-Fired Ceramic And Direct Bonded Copper For Single Ended Primary Inductance Topology, Kristopher Cody Johnson
Comparison Of Low-Temperature Co-Fired Ceramic And Direct Bonded Copper For Single Ended Primary Inductance Topology, Kristopher Cody Johnson
Electrical Engineering Undergraduate Honors Theses
This work examines the thermal dissipation characteristics of Low-Temperature Co-fired Ceramic (LTCC) and Direct Bonded Copper (DBC) with the implementation of a Single Ended Primary Inductance Converter (SEPIC) topology. The advantages and disadvantages of the two substrates will be explored in addition to a description of the design and control of the SEPIC. It will be shown that the DBC implementation is superior with regards to thermal dissipation, but that LTCC has advantages in high- density packaging, RF applications, and embedded components. These substrates and converters provide many advantages in industrial applications that include automotive and grid level implementations. Additional …