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Investigating Mems Devices In Flow Conditions Relevant To Flow-Through Systems., Mohammad Shafquatul Islam

Electronic Theses and Dissertations

Advancements in microscale actuating technologies has substantially expanded the possibilities of interacting with the surrounding environment. Microstructures that deflect in response to mechanical forces are one of the largest application areas of microelectromechanical systems (MEMS). MEMS devices, functioning as sensors, actuators, and support structures, find applications in inertial sensors, pressure sensors, chemical sensors, and robotics, among others. Driven by the critical role of catalytic membrane reactors, this dissertation aims to evaluate enzyme activity on polymeric membranes and explore how fabrication methods from the field of Electrical and Computer Engineering (ECE) can incorporate sensing and actuation into these porous surfaces. Toward …

Fabrication Of Silicon Microneedles For Dermal Interstitial Fluid Extraction In Human Subjects, Caleb A. Berry

Electronic Theses and Dissertations

The goal of this project is to design and develop a fabrication process for silicon microneedle arrays to extract dermal interstitial fluid (ISF) from human skin. ISF is a cell- free, living tissue medium that is known to contain many of the same, clinical biomarkers of general health, stress response and immune status as in blood. However, a significant barrier to adoption of ISF as a diagnostic matrix is the lack of a rapid, minimally invasive method of access and collection for analysis. Microfabricated chips containing arrays of microneedles that can rapidly and painlessly access and collect dermal ISF for …

Microrobots For Wafer Scale Microfactory: Design Fabrication Integration And Control., Ruoshi Zhang

Electronic Theses and Dissertations

Future assembly technologies will involve higher automation levels, in order to satisfy increased micro scale or nano scale precision requirements. Traditionally, assembly using a top-down robotic approach has been well-studied and applied to micro-electronics and MEMS industries, but less so in nanotechnology. With the bloom of nanotechnology ever since the 1990s, newly designed products with new materials, coatings and nanoparticles are gradually entering everyone’s life, while the industry has grown into a billion-dollar volume worldwide. Traditionally, nanotechnology products are assembled using bottom-up methods, such as self-assembly, rather than with top-down robotic assembly. This is due to considerations of volume handling …

Exploration Of Radiation Damage Mechanism In Mems Devices., Pranoy Deb Shuvra

Electronic Theses and Dissertations

We explored UV, X-ray and proton radiation damage mechanisms in MEMS resonators. T-shaped MEMS resonators of different dimensions were used to investigate the effect of radiation. Radiation damage is observed in the form of resistance and resonance frequency shift of the device. The resistance change indicates a change in free carrier concentration and mobility, while the resonance frequency change indicates a change in mass and/or elastic constant. For 255nm UV radiation, we observed a persistent photoconductivity that lasts for about 60 hours after radiation is turned off. The resonance frequency also decreases 40-90 ppm during irradiation and slowly recovers at …

Strategies And Techniques For Fabricating Mems Bistable Thermal Actuators., Dilan Ratnayake

Electronic Theses and Dissertations

Bistable elements are beginning to appear in the field of MEMS as they allow engineers to design sensors and actuators which require no electrical power and possess mechanical memory. This research focuses on the development of novel strategies and techniques for fabricating MEMS bistable structures to serve as no electrical power thermal actuators. Two parallel strategies were explored for the design and fabrication of the critical bistable element. Both strategies involved an extensive material study on candidate thin film materials to determine their temperature coefficient of expansion and as-deposited internal stress properties. Materials investigated included titanium tungsten, Invar, silicon nitride …

Fabrication And Characterization Of Torsional Micro-Hinge Structures, Mike Madrid Marrujo

Master's Theses

ABSTRACT

Fabrication and Characterization of Torsional Micro-Hinge Structures

Mike Marrujo

There are many electronic devices that operate on the micrometer-scale such as Digital Micro-Mirror Devices (DMD). Micro actuators are a common type of DMD that employ a diaphragm supported by torsional hinges, which deform during actuation and are critical for the devices to have high stability and reliability. The stress developed within the hinge during actuation controls how the actuator will respond to the actuating force. Electrostatically driven micro actuators observe to have a fully recoverable non-linear viscoelastic response. The device consists of a micro-hinge which is suspended by two …

Modeling And Development Of A Mems Device For Pyroelectric Energy Scavenging, Salwa Mostafa

Doctoral Dissertations

As the world faces an energy crisis with depleting fossil fuel reserves, alternate energy sources are being researched ever more seriously. In addition to renewable energy sources, energy recycling and energy scavenging technologies are also gaining importance. Technologies are being developed to scavenge energy from ambient sources such as vibration, radio frequency and low grade waste heat, etc. Waste heat is the most common form of wasted energy and is the greatest potential source of energy scavenging.

Pyroelectricity is the property of some materials to change the surface charge distribution with the change in temperature. These materials produce current as …

Surface Micromachined Pressure Sensors, William P. Eaton Iv

Electrical and Computer Engineering ETDs

Surface micromachined pressure sensors were designed, modeled, fabricated, and tested. They employed a piezoresistive transduction mechanism and were based upon circular diaphragms, which vary from 50 to 1000 μm in diameter and 1 to 2 μm in thickness. The piezoresistors were placed in Wheatstone bridge configurations to provide simple signal amplification and first order temperature compensation.

Of the different micromachining techniques, surface-micromachining has the advantage of being the most similar to integrated circuit manufacturing. Hence an existing IC equipment set can be used to create mechanical structures. Furthermore, the monolithic integration of a mechanical device with control electronics is simpler …