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High Performance Low Voltage Power Mosfet For High-Frequency Synchronous Buck Converters, Boyi Yang
High Performance Low Voltage Power Mosfet For High-Frequency Synchronous Buck Converters, Boyi Yang
Electronic Theses and Dissertations
Power management solutions such as voltage regulator (VR) mandate DC-DC converters with high power density, high switching frequency and high efficiency to meet the needs of future computers and telecom equipment. The trend towards DC-DC converters with higher switching frequency presents significant challenges to power MOSFET technology. Optimization of the MOSFETs plays an important role in improving low-voltage DC-DC converter performance. This dissertation focuses on developing and optimizing high performance low voltage power MOSFETs for high frequency applications. With an inherently large gate charge, the trench MOSFET suffers significant switching power losses and cannot continue to provide sufficient performance in …
Design And Characterization Of High Temperature Packaging For Wide-Bandgap Semiconductor Devices, Brian Grummel
Design And Characterization Of High Temperature Packaging For Wide-Bandgap Semiconductor Devices, Brian Grummel
Electronic Theses and Dissertations
Advances in wide-bandgap semiconductor devices have increased the allowable operating temperature of power electronic systems. High-temperature devices can benefit applications such as renewable energy, electric vehicles, and space-based power electronics that currently require bulky cooling systems for silicon power devices. Cooling systems can typically be reduced in size or removed by adopting wide-bandgap semiconductor devices, such as silicon carbide. However, to do this, semiconductor device packaging with high reliability at high temperatures is necessary. Transient liquid phase (TLP) die-attach has shown in literature to be a promising bonding technique for this packaging need. In this work TLP has been comprehensively …